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主要用途:兼容B、P、H、He、N、O等多种离子,采用水平+垂直高速电扫描,晶圆局部温差小,可用于Ge探测器、材料改性等离子注入工艺,设备机械结构相对简单,成本优势显著。Main application: Suitable for many kinds of ion such as B, P, H, He, N, O implanting. By using horizontal plus vertical high speed electrostatic scan, the temperature difference among parts of the wafer are small. This tool can be used for ion implanting jobs such as Ge detector and material modification. The mechanical structure is relatively simple, so the cost is relatively low.
主要特点Main Characteristics:
1、水平电扫描+垂直电扫描,实现4吋/6吋范围辐照,满足长时间的高剂量注入;Horizontal plus vertical electrostatic scan, achieve 4 inch or 6 inch scan range, it can implant during a long time and high dose.
2、靶台具备自转及冷却能力,满足片装及带孔的结构注入;The target platen have the ability of twisting and cooling, either wafers or products with a hole can be implanted.
3、手动装载样品,结构简单紧凑,单价最高能量可升级至200keV。Manually load and unload, the structure is simple and compact, the maximum univalent energy could reach 200KeV.
主要技术指标Main Parameters
离子能量(Energy) | 20-60keV(单电荷Sinlge Charge) |
晶片尺寸(Wafer Size) | 4 inch,6 inch |
剂量注入范围(Dose Range) | 1E12 - 1E17 ions/cm2 |
产品应用(Applications) | Ge探测器、材料改性等离子注入工艺; Ge detector and material modification etc. |